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Multilayer PCB
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Multilayer PCB
- Home
- Multilayer PCB
Advantages of multilayer PCB
Why Choose Us
Advanced Multilayer PCB Manufacturing
Our company specializes in the production of high-quality multilayer PCBs, utilizing state-of-the-art equipment and technology. We are capable of producing multilayer PCBs with a high layer count, ensuring stability, reliability, and optimal electrical performance. Whether it's for complex industrial control systems, medical devices, or automotive applications, our manufacturing processes meet the highest industry standards, providing robust solutions for demanding projects.
Fast Delivery
With a well-organized production system and efficient workflow, we minimize lead times for multilayer PCB manufacturing. Our experienced team and optimized supply chain allow us to quickly turn around even large and complex orders without compromising on quality. This ensures that our clients can meet tight project deadlines and maintain a competitive edge in their respective markets.
Flexible Customization
We understand that different industries and projects have unique requirements, which is why we offer a wide range of customization options for multilayer PCBs. From material selection to layer count, thickness, and layout design, we collaborate closely with clients to ensure the PCBs are tailored to specific needs. Whether it's for high-density, high-speed circuits or specific thermal management needs, we provide flexible solutions that cater to various industry demands.
Strict Quality Control
Quality is our top priority, and we implement rigorous testing and inspection procedures throughout every stage of the multilayer PCB production process. From raw material inspection to in-process quality checks and final testing, we ensure that each PCB meets or exceeds international standards. Our commitment to quality ensures that our PCBs deliver reliable, long-term performance in even the most critical applications, giving clients peace of mind.
production capacity
Items | Rigid |
Material | Lead-free、Halogen-free、H-Tg、Low loss |
Layers | 1-40L |
Max cut lamination size | Min3*3mm-Max1200mm |
Final board thickness | 0.18-5.0mm |
Min Final Hole size | 0.075mm |
Aspect Ratio | 14:1 |
Inner layer Line Width/Space | 0.05mm |
Copper Foil Thickness (Inner Layers) | 1/2oz~3.0oz |
Min dielectric layer thickness | 50um |
Copper Foil Thickness (Outer Layers) | Hoz-14oz |
Copper to drill distance | 0.2mm |
Out layer Line width/space | 0.05mm |
Min SMD width | 0.05mm |
Max Solder Mask Plug Hole Diameter | 0.5mm |
solder mask strip width | 0.075mm（Green/1OZ） |
Final Set Size Tolerance | ±0.1mm/limit±0.05mm |
Min Hole to board edge Distance | 0.15mm |
Min Beveling angle Tolerance | ±3-5° |
Layer to layer Tolerance | ≤0.075mm(1-6L） |
Inner layer Min PTH Annular Ring | 0.15mm |
Out layer Min PTH Annular ring | 0.15mm |
Surface Treatment | OSP、HASL 、ENIG、Gold Finger、Plating Gold 、ENEPIG、IMM TIN、IMM AG |
Warp&Twist | ≤0.5% |
PCB factory display
Frequently Asked Questions
Yes, as per the client requirements, we are well equipped to offer first article inspection for through hole PCBs.
DIP (Dual In-line Package) and THT (Through-Hole Technology) are both important terms in the field of electronic component packaging and PCB assembly.
DIP, also known as Dual In-line Package or DIL Package, refers to a specific type of electronic component packaging that features two parallel rows of pins or leads extending from the bottom of the package. DIP package is widely used in electronic assemblies due to their compact size and ease of insertion into PCBs.
THT, on the other hand, stands for Through-Hole Technology. It refers to the manufacturing process that involves drilling holes on a PCB and inserting component leads or pins through these holes. The components are then soldered on the opposite side of the PCB to establish electrical connections.
While DIP is commonly associated with the type of component package used in PCB assembly, THT is the manufacturing process that involves the insertion and soldering of components through holes.
SMT is a widely adopted electronic assembly technology that utilizes SMD components and automated placement machines for the assembly process. This technology offers several advantages, including enhanced processing efficiency and reduced form factor of electronic applications.
On the other hand, THT is more challenging to automate and involves the use of larger components. THT offers the advantage of providing a stronger and more robust connection due to the through-hole soldering technique. It is particularly suitable for components that require additional mechanical support or for applications where durability and reliability are critical.
Well, whether to select through hole PCB assembly or SMT PCB assembly; it totally depends on your requirements. Most of the integrated circuits go for SMT package. However, for connectors, switches, or mechanical power parts, the standard way is to use through hole parts.
