KING FIELD ELECTRONIC CO., LTD

PCB/PCBA One-Stop Service Manufacturer

Metal Core PCB

Metal Core PCB Services

Specialized Metal-Based PCB Manufacturing:
We focus on producing high thermal conductivity metal-based PCBs suitable for applications with high heat dissipation requirements.
Advanced Thermal Management Technology:
Our PCBs provide excellent heat dissipation performance, ensuring stable operation of electronic components in high-temperature environments.
Multiple Material Options:
We offer various metal substrates, including aluminum and copper, to meet diverse application needs.
High Strength and Durability:
Our stringent manufacturing processes and quality control ensure that metal-based PCBs have high strength and a long lifespan.

Why Choose Us

Specialized Metal-Based PCB Manufacturing:

Our company specializes in the production of high thermal conductivity metal-based PCBs, leveraging advanced manufacturing techniques to ensure superior quality. These PCBs are designed to efficiently transfer heat away from critical components, making them ideal for applications such as LED lighting, power electronics, and automotive systems. With our expertise, we deliver reliable and effective solutions tailored to the specific thermal management needs of our clients.

Advanced Thermal Management Technology:

We utilize cutting-edge thermal management technology in our metal-based PCBs to enhance heat dissipation performance. This ensures that electronic components can operate at optimal temperatures, reducing the risk of overheating and improving overall system reliability. Our designs integrate innovative thermal pathways that maximize heat transfer, providing robust solutions for industries where thermal performance is critical.

Multiple Material Options:

To accommodate a wide range of applications, we offer a variety of metal substrate options, including aluminum, copper, and other specialized materials. Each material is chosen based on its thermal and electrical properties, allowing us to provide customized solutions that meet specific operational requirements. This flexibility enables us to serve diverse sectors such as consumer electronics, telecommunications, and industrial applications, ensuring that our clients receive the best material for their unique needs.

High Strength and Durability:

Our manufacturing processes adhere to strict quality control standards, ensuring that our metal-based PCBs exhibit high strength and durability. We conduct rigorous testing at each production stage to confirm that our products can withstand demanding conditions and extended use. This commitment to quality means that our clients can rely on our PCBs for long-term performance, even in challenging environments, reducing maintenance and replacement costs.

production capacity

Items

Rigid

Material

Lead-free、Halogen-free、H-Tg、Low loss

Layers

1-40L

Max cut lamination size

Min3*3mm-Max1200mm

Final board thickness

0.18-5.0mm

Min Final Hole size

0.075mm

Aspect Ratio

14:1

Inner layer Line Width/Space

0.05mm

Copper Foil Thickness (Inner Layers)

1/2oz~3.0oz

Min dielectric layer thickness

50um

Copper Foil Thickness (Outer Layers)

Hoz-14oz

Copper to drill distance

0.2mm

Out layer Line width/space

0.05mm

Min SMD width

0.05mm

Max Solder Mask Plug Hole Diameter

0.5mm

solder mask strip width

0.075mm(Green/1OZ)

Final Set Size Tolerance

±0.1mm/limit±0.05mm

Min Hole to  board edge Distance

0.15mm

Min Beveling angle Tolerance

±3-5°

Layer to layer Tolerance

≤0.075mm(1-6L)

Inner layer Min PTH Annular Ring

0.15mm

Out layer Min PTH Annular ring

0.15mm

Surface Treatment

OSP、HASL 、ENIG、Gold Finger、Plating Gold 、ENEPIG、IMM TIN、IMM AG

Warp&Twist

≤0.5%

PCB Factory Display

Frequently Asked Questions

Do you offer first article inspection for through hole PCB?

Yes, as per the client requirements, we are well equipped to offer first article inspection for through hole PCBs.

The relationship between DIP and THT?

DIP (Dual In-line Package) and THT (Through-Hole Technology) are both important terms in the field of electronic component packaging and PCB assembly.

DIP, also known as Dual In-line Package or DIL Package, refers to a specific type of electronic component packaging that features two parallel rows of pins or leads extending from the bottom of the package. DIP package is widely used in electronic assemblies due to their compact size and ease of insertion into PCBs.

THT, on the other hand, stands for Through-Hole Technology. It refers to the manufacturing process that involves drilling holes on a PCB and inserting component leads or pins through these holes. The components are then soldered on the opposite side of the PCB to establish electrical connections.

While DIP is commonly associated with the type of component package used in PCB assembly, THT is the manufacturing process that involves the insertion and soldering of components through holes.

The concept of SMT and THT

SMT is a widely adopted electronic assembly technology that utilizes SMD components and automated placement machines for the assembly process. This technology offers several advantages, including enhanced processing efficiency and reduced form factor of electronic applications.

On the other hand, THT is more challenging to automate and involves the use of larger components. THT offers the advantage of providing a stronger and more robust connection due to the through-hole soldering technique. It is particularly suitable for components that require additional mechanical support or for applications where durability and reliability are critical.

What should l prefer - Through Hole PCB assembly Or SMT PCB Assembly?

Well, whether to select through hole PCB assembly or SMT PCB assembly; it totally depends on your requirements. Most of the integrated circuits go for SMT package. However, for connectors, switches, or mechanical power parts, the standard way is to use through hole parts.